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    DSAISS0006719.pdf

    • Central Semiconductor
    • PROCESS CPZ25 Zener Diode 1.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 33.5 x 33.5 MILS Die Thickness 7.9 MILS Anode Bonding Pad Area 23
    • Original
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