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    DSAISS0006710.pdf

    • Central Semiconductor
    • PROCESS Triac CPQ130 12 Amp, 600 Volt Triac Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 130 x 130 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad A
    • Original
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    DSAISS0006710.pdf preview Download Datasheet

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