Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAISS0006707.pdf

    • Central Semiconductor
    • PROCESS TRIAC CPQ057 2 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 57 x 57 MILS Die Thickness 9.1 MILS MT1 Bonding Pad Area 29 x 17
    • Original
    • Price & Stock Powered by Findchips

    DSAISS0006707.pdf preview Download Datasheet

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel