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DSA0070588.pdf
Manufacturer
ROHM
Partial File Text
Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste (Sn-3Ag-0.5Cu) version CONTENTS Recommended condition of reflow solde
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
1SS355
1SS376
1SS380
M705-GRN-360-K2-V
M705-GRN360
M705-GRN360-K2
M705-GRN360-K2-V
M705-GRN360-K2V
solder paste M705-GRN360-K2-V
ST-100S
TOSHIBA GLASS MOLD