DSA00429605.pdf by Toshiba

Partial File Text Doc. No.03SAP0037 Date: July 10, 2003 Announcement of Implementation of Leadfree Finish of System LSI Semiconductor Products manufactured in Japan Dear Sir/Madam In consideration of the
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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03SAP0037 Lead Free reflow soldering profile BGA toshiba new label