DSAH00216725.pdf by IXYS

Partial File Text Assembly Instructions MOS/IGBT Chips Recommended Solder System IXYS recommends a soft solder chip attach using a solder composition of 92.5 % Pb, 5 % Sn and 2.5 % Ag. The maximum chip attach tempe
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAH00216725.pdf preview Download Datasheet