DSA00522395.pdf by Ohmite

Partial File Text FEATURES · Superior thermal expansion cycling · Inductance less than 10 nanohenries · Flameproof · Solderable pads: Tin (Sn) plate · Lead flexible for thermal expansion · Low termination stress ("J"
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA00522395.pdf preview Download Datasheet