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    DSA0062299.pdf

    • PDF: 2001 May 16 Philips Semiconductors Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A
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    MS 034 MS-034 SOT-623 sot623
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