DSA0057181.pdf

Partial File Text PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA960: plastic, heatsink ball grid array package; 960 balls; body 33 x 33 x 2.4 mm SOT683-1 B D A D1 ball A1 index
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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HBGA960 MS-034 sot683

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