DSA0057161.pdf by Philips Semiconductors

Partial File Text PDF: 2001 Nov 13 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
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