DSA00312318.pdf by Central Semiconductor

Partial File Text PROCESS CPS041 Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 41 x 41 MILS Die Thickness 8.7 MILS ± 0.6 MILS
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Active
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BRX49 BRX49 datasheet BRX49 SCR CPS041 CS18D CS89M CS92D SCR BRX49

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