DSA00425449.pdf by Skyworks Solutions

Partial File Text Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperat
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Ablebond Ablebond 8380 Ablestik 8380 APN3001 Die Attach epoxy stamping FR4 substrate epoxy FR4 substrate height and thickness