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    DSA0050094.pdf

    • OKI Electric Industry
    • Oki's ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market's Requirement for New ASIC Packaging Technology ยท The need for increased functi
    • Original

    DSA0050094.pdf preview Download Datasheet

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    0.3mm pitch csp package 0.4mm pitch BGA ceramic QFP Package 100 lead gps watch oki packaging oki pitch PCB design for very fine pitch csp package wcsp reliability

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