SBT-BGA-6002 datasheet by Ironwood Electronics
- Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size X (mm): 27; IC Size Y (mm): 27; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.4; IC Ball Height Max (mm): 0.6; IC Ball Diameter Max (mm): 0.7; Max Package Code: BGA676C; Part Description: Stamped pin Burn-in socket
- Original
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