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GHz BGA Sockets-0.8mm; IC Size X (mm): 10; IC Size Y (mm): 10; IC Array X: 12; IC Array Y: 12; Max Pincount: 144; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.08; IC Ball Diameter Max (mm): 0.35; IC Ball Height Max (mm): 0.28; IC Ball Height Min (mm): 0.18; IC Size Tolerance (mm): 0.05; IC Total Height Max (mm): 1.2; Max Package Code: BGA144J; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)
