SG-BGA-6061 datasheet by Ironwood Electronics
- GHz BGA Sockets-0.8mm; IC Size X (mm): 13.5; IC Size Y (mm): 5.5; IC Array X: 16; IC Array Y: 6; Max Pincount: 96; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.35; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.5; Max Package Code: BGA96C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
