GHz BGA Sockets-0.8mm; IC Size X (mm): 18; IC Size Y (mm): 20; IC Array X: 22; IC Array Y: 24; Max Pincount: 528; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.7; Max Package Code: BGA528; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)
