High Density GHz BGA Sockets; Max Pincount: 54; Top Pitch (mm): 0.4; IC Array X: 9; IC Arr... ay Y: 6; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.83; IC Size X (mm): 3.637; IC Size Y (mm): 2.47; IC Size Tolerance (mm): 0.05; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.16; IC Ball Height Max (mm): 0.2; IC Ball Diameter Max (mm): 0.26; Max Package Code: BGA54; Part Description: GHz BGA Socket (ZIF)-HDmore
