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DSA00837.pdf
Manufacturer
Intel
Partial File Text
White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Des
Datasheet Type
Original
ECAD Model
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32-1055
EP80579
fanless motherboard
heat exchanger process
heat pipes
intel liquid cooling
loop heat pipes
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