DSA2H0051456.pdf by Foxconn

Partial File Text SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05"] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Forc
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA2H0051456.pdf preview

Download Datasheet

User Tagged Keywords

bga solder ball shear foxconn