Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0037438.pdf

    • Mitsubishi
    • MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1
    • Original
    • Price & Stock Powered by Findchips

    DSA0037438.pdf preview Download Datasheet

    User Tagged Keywords

    AuSn eutectic eftec 45 MF202 MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni SC-101 Si3N4 silicon carbide

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel