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DSA0037401.pdf
by Mitsubishi
Partial File Text
MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.6 CLEANING PROCESS CFCs (CFC-113), Trichlene, 1.1.1-trichloroethane have conventionally been used to clean flux upon completion o
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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