DSA00420955.pdf by M/A-COM

Partial File Text Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers Abstract A test methodology will be presented which combines the advantage of on-wafer RF probing with a TRL calibration
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71200-H1 LNA x-band maam 23000-A1 MAAM28000-A1 MAAM71200-H1 mmic case styles OXLEY x-band lna chip x-band mmic lna