DSA00307286.pdf by STMicroelectronics

Partial File Text PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG-COM/03/145 PCN LEADFREE PLATING FOR SO8 PACKAGE IN MUAR first lines 2003/02/7 PCN DSG-COM/03/145 Product Family /Commercial Product STANDAR
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00307286.pdf preview

Download Datasheet

User Tagged Keywords

Ablebond 71 Ablebond 8390 bond pull test die tilt LM358CD LM358D LM393 MP8000 mp8000 CH4 PPF leadframe ppt on ic so8 Wire bond TL082 TL082CD TL431CD