DSAE0028260.pdf by Freescale Semiconductor

Partial File Text Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array (LGA) Style Packages 1 Introduction This appl
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AN1902 AN3281 AN3311 BGA PACKAGE thermal resistance Freescale bga PCB footprint fr-5 laminate Lead Free reflow soldering profile BGA LGA PACKAGE thermal resistance Freescale LGA voiding reflow profile FOR LGA COMPONENTS

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