DSA00156988.pdf by SiGe Semiconductor

Partial File Text APPLICATION NOTE 10-APP-13 PA2423MB Component Mount Process Guidelines General Description PA2423MB is packaged in an 8 leads MSOP surface mount package with an exposed die pad. The package body
Datasheet Type Original
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PA2423 PA2423MB pcb footprint reflow profile SiGe Microsystems thermal pcb guidelines