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    DSAZIHA1000152504.pdf by Packard Hughes Interconnect

    • Bemerkungen NOTES Kontakt: Veredelung im Kontaktierungsbereich min.0.8 µm AuCo 0.3 über 1.25-2.25 µm Ni TERMINAL: PLATING CONTACT AREA: MIN.0.8 µm AuCo 0.3 OVER 1.25-2.25 µm Ni 1 3
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