DSA00301022.pdf

Partial File Text dallas semiconductor reliability report: Process: Metal: Single Poly, Single Metal (Ti/TiN layers 0.6 µm Al / 0.5% Cu / 0.8% Si Gate Ox Thickness: Summary Data with Chi-Square Distrib
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA00301022.pdf preview

Download Datasheet

User Tagged Keywords

DS1208 DS12885 DS2401 DS2405 DS2409 DS2415 ti 9841

Price & Stock Powered by