DSAHI00025119.pdf by Not Available

Partial File Text ! 220 hxeii l a v o u i C o n n e c t o t s *2jnm pitch. to · Available with low frequency, high frequency and high power contacts. · Integral jacking mechanism. I footprint for ised packaging
Datasheet Type Scan
RoHS No
Pb Free Unknown
Lifecycle Transferred

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FH202