DSASW00220628.pdf by KOA Speer Electronics

Partial File Text KA, SC hybrid IC EU features · Adjustment processes are decreased by function and ratio trimmings · High density mounting by bonding (COB) · Various types of package are available · High r
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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0.4mm pitch BGA AI2O3 BGA and QFP Package mounting hybrid ic sc ka Noble resistor pitch 0.4mm BGA QFP 0.2mm pitch QFP 0.3mm pitch QFP lead pitch 0.3mm

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