DSA2H002893.pdf by Aries Electronics

Partial File Text 14-307799-11 12 Ball MicroBGA to 14 Pin .3 Dip Adapter FEATURES: · A cost effective means of bread boarding BGA packages. · Available on .300 [7.62] centers. GENERAL SPECIFICATIONS: · Board material
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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