This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
Reportable Substances in Components
Package Type :
Lead #:
No
1
Material
Molding Compound
Component Weight :
SOICW Document No :
16
Process Type :
Content in %
70.30%
Content
in gr
Findchips