DSAZIHA2X00060354.pdf by Micrel Semiconductor

Partial File Text Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink ICâs have a large solder pad in the middle. The official function of this pad is
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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