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    DSA00173910.pdf

    • National Semiconductor
    • Plastic Package Moisture-Induced Cracking Introduction With the older "through-hole" technology packages such as the Dual In-line Package (DIP), soldering to printed circuit boards was accomplishe
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    DSA00173910.pdf preview Download Datasheet

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    Furnace MIL-D-3464 MIL-D-3464 type 1 MIL-D-3464 type 1 and 2 MIL-D3464 MILD-3464
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