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    DSA0071272.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QSOP16 CASE 492­01 ISSUE O DATE 03/01/2001 SCALE 4:1 ­A­ Q R H x 45_ U RAD. 0.013 X 0.005 DP. MAX ­B­ MOLD PIN MARK RAD. 0
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