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    DSASW00135452.pdf

    • Central Semiconductor
    • PROCESS CPD91V Switching Diode Low Leakage Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Anode Bonding Pad Are
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW00135452.pdf preview Download Datasheet

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    CMDD6001 CMLD6001 CMLD6001DO CMOD6001 CMPD6001 CPD91V r2 137
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