DSASW00135444.pdf by Central Semiconductor

Partial File Text PROCESS CPD48V Schottky Diode High Current Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13.8 x 13.8 MILS Die Thickness 7.1 MILS Anode Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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"Schottky Diode" CPD48V DIODE 720 DIODE R3 high current schottky diode

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