Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00135438.pdf

    • PROCESS CPD102X Schottky Diode High Voltage Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 9.0 x 9.0 MILS Die Thickness 5.9 MILS Anode Bonding Pad A
    • Original
    • Unknown
    • Unknown
    • Unknown

    DSASW00135438.pdf preview

    Price & Stock Powered by
    Supplyframe Tracking Pixel