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DSASW00135431.pdf
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Partial File Text
PROCESS CP753V Small Signal Transistors PNP - High Current Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 7.1 MILS Base Bon
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
chip bonding die
CP753V
CZT953