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    DSASW00135418.pdf

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    • PROCESS CP611 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 80 x 99 MILS Die Thickness 12.5 ± 1 MILS Base Bonding P
    • Original

    DSASW00135418.pdf preview Download Datasheet

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