DSASW00135409.pdf

Partial File Text PROCESS CP382X Small Signal Transistor NPN - Low VCE(SAT) Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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cmlt3820g CMPT3820 CXT3820 TRANSISTOR 536

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