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    DSASW00135402.pdf

    • PROCESS CP324 Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.
    • Original
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    DSASW00135402.pdf preview

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    2N7002 CP324
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