DSASW00135383.pdf

Partial File Text PROCESS CP211 Power Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 80 x 99 MILS Die Thickness 12.5 MILS Base Bonding Pad A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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2N3054A chip die npn transistor CJD41C CP211 TIP41C transistor CR NPN

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