Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSARS009967.pdf

    • Amkor Technology
    • LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array (TEPBGA): Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance.
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSARS009967.pdf preview Download Datasheet

    User Tagged Keywords

    4-Layer Amkor mold compound Amkor Wafer level mold compound CCL-HL-832 CCL-HL832 CCL-HL832NX CCL-HL832NX-A G750* G750 mold compound Sumitomo 1000 GE-100-LFC GE-100L GE-100LFCS GE100LFCS GE100LFCS nitto MS-034 Nitto nitto chip Nitto GE100LFCS nitto tape 55 Sumitomo G750 tepbga-2
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel