DASF0048317.pdf by Maxim Integrated Products

Partial File Text Maxim > App Notes > GENERAL ENGINEERING TOPICS Keywords: Thermal, Theta-ja, Theta-jc, heat, Theta-jb, Psi-jb Jul 16, 2007 APPLICATION NOTE 4083 Thermal Characterization of IC Packages Abstr
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AN4083 APP4083 JEDEC JESD51-8 JEDEC51-1 JEDEC51-12 JESD-51 JESD51 JESD51-1 JESD51-12 JESD51-2 JESD51-3 JESD51-4 JESD51-5 JESD51-7 JESD51-8 mold compound high thermal conductivity

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