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DSASW00188312.pdf
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Partial File Text
BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width × package length 27.00 × 27.00 mm
Datasheet Type
Original
ECAD Model
DSASW00188312.pdf preview
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256-pin Plastic BGA
BGA-256P-M21
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