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DSA00167942.pdf
by Texas Instruments
Partial File Text
ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time "GENERIC" QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer F
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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User Tagged Keywords
F642790
TEXAS INSTRUMENTS, die attach
TGB2000
TGC2000
TGC3000
wafer fab control
wafer fab control plan
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