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    DSASW00187144.pdf by Fujitsu

    • FLIP CHIP BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 1600 PIN CERAMIC BGA-1600C-M01 1600-pin ceramic FCBGA Lead pitch 1.00 mm Package width × package length 42.50 × 42.50
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    FCBGA
    Supplyframe Tracking Pixel