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DSASW00187144.pdf
by Fujitsu
Partial File Text
FLIP CHIP BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 1600 PIN CERAMIC BGA-1600C-M01 1600-pin ceramic FCBGA Lead pitch 1.00 mm Package width × package length 42.50 × 42.50
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Original
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Unknown
Pb Free
Unknown
Lifecycle
Unknown
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FCBGA