DSASW00187017.pdf by Fujitsu

Partial File Text IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujit
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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30-PIN 96 BCC package BGA 256 PACKAGE thermal resistance CERAMIC PIN GRID ARRAY wire lead frame ebga 304 FBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance lead frame pin grid array PCB design for very fine pitch csp package Sharp Packages SSOP SUPER CHIP TSOP 48 stacked flash bonding TSOP 48 thermal resistance