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DSASW00185579.pdf
Manufacturer
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Partial File Text
Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attenti
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
BGA and QFP Package
LQFP-256
lQFP256
QFP PACKAGE thermal resistance
SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
TEQFP208